Dec 16th, 2008 - Frontline announces the release of InPlan™ 2.60
Frontline PCB Solutions announces the release of version 2.60 of its InPlan™ engineering system on December 16, 2008.
InPlan™ 2.60 introduces new functionalities and enhancements, including storage of part profiles in the InPlan job thus enabling engineering a job while its CAM data is archived, significant improvements in the Impedance Coupon Generator as well as a new buildup algorithm to generate high layer count buildups faster. InPlan V2.60 also provides a better control over automatic changes made in a production traveller, enabling the automatic change of traveller attribute values and notes without applying a change on the manufacturing flow. InPlan V2.60 users will increase work efficiency between CAM & Engineering through the ability to ignore redundant CAM analysis results in Engineering work .
InPlan V2.60 enables engineering of an etched foil process through consideration of thickness loss through resin flow on both sides of the etched foil in Stackup design.
Starting from Version 2.60, Impedance Coupon generator may be offered as an InStack™ Cost option, primarily valuable to the user due to the ability to automatically generate impedance coupons for all impedance constraints modelled through Stackup design process – all within the same system. |